Solder Flux Paste NC‑559‑ASM Tin Cream No‑Clean Rework Solder Paste for Phone Repair Soldering (100g)
✅ Smooth flow
✅ Strong hold
✅ Low residue
✅ Easy apply
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Upgrade your soldering efficiency and precision with the AMTECH Flux Type NC-559 ASM Solder Paste (100g) — a high-quality, reliable flux formulation trusted by professionals in electronics repair and assembly. Designed to provide smooth, clean, and consistent soldering performance, this flux paste ensures excellent wetting, strong joint formation, and minimal residue, making it an essential tool for BGA reballing, SMD soldering, and PCB repair.
Its non-corrosive, no-clean formula eliminates the need for post-solder cleaning, reducing work time without compromising on connection reliability. Ideal for technicians working with delicate or high-density circuits, the NC-559 ASM paste flows evenly and reacts quickly to heat, ensuring optimal contact and conductivity in every application.
Key Features:
✅ High-Performance Flux Formula
Specially engineered for BGA, SMD, and micro-soldering, offering smooth flow and strong adhesion.
✅ No-Clean & Non-Corrosive
Leaves minimal residue and requires no cleaning after soldering — safe for sensitive components.
✅ Excellent Wetting & Spreadability
Ensures strong, consistent joints and uniform solder flow for professional-grade results.
✅ Temperature-Stable & Long Shelf Life
Maintains integrity in various temperatures with a long-lasting usable period.
✅ Ideal for Repair & Rework Tasks
Perfect for mobile, computer, and PCB repair centers requiring precision soldering.